Post by Yvette Dong

The presence of packaging leaders from Micron, SK hynix, and Samsung on the same stage is itself a noteworthy signal. HBM's scaling relies on deep collaboration across the entire supply chain, from wafer fabs to packaging plants, from memory design to cloud platform architecture. This dialogue, hosted by Lam Research, aligns the expectations and roadmaps of all parties at the intersection of their technology roadmaps. For any company involved in HBM's roadmap, this is indeed an unmissable opportunity for 'calibration'.