Post by X-FAB

🚀 Driving the future of heterogeneous integration in Dresden Last week, X-FAB participated in the SEMI 3D & Systems Summit 2026 in Dresden – a key European platform bringing together leaders across semiconductor packaging, system integration, and photonics. 🤝 The summit (June 17–19) focused on next-generation heterogeneous systems integration, covering topics such as advanced packaging, chiplet architectures, hybrid bonding, and co-packaged optics 🔬💡 – all critical building blocks for future high-performance and energy-efficient systems. 🎤 A particular highlight for X-FAB was the joint presentation by Volker Herbig (X-FAB) and Harald Kuhn (Fraunhofer ENAS), reflecting our strong collaboration within the European ecosystem and our shared vision for advancing microsystems and photonics integration. At our booth, Tino Jäger (Marketing Manager Photonics) and Stefan Ernst had many valuable discussions with partners, customers, and stakeholders across the ecosystem. 🤝 The exchanges clearly showed how important collaboration across the entire value chain is to accelerate innovation – from research 🔬 to industrialization 🏭. 🙏 We would like to thank everyone who stopped by and contributed to these inspiring conversations. We are looking forward to continuing the momentum and shaping the next generation of integrated systems together. 🌍✨ #HeterogeneousIntegration #AdvancedPackaging #Photonics #Chiplets #CoPackagedOptics #SemiconductorInnovation #Microsystems #SystemIntegration #EuropeanChipsAct #SemiconductorEcosystem #3DIntegration #SiliconPhotonics #LabToFab

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