Post by Vertiv

High-density computing requires thermal expertise at every level — from chip to facility. Last week, the Vertiv Thermal Champions event brought together leaders, engineers, product managers, and technical experts to explore how thermal fluid dynamics, controls engineering, and product development help address rack-level heat rejection in high-density environments. From chip-level thermal management to advanced cooling systems and controls, the event demonstrated the breadth of engineering expertise required to meet the demands of today’s digital infrastructure. Internal knowledge-sharing sessions like these play a key role in aligning teams across the organization, fostering collaboration, and ensuring we are well prepared to support our customers with innovative solutions and the expertise needed to address their evolving requirements. Thank you to everyone across Vertiv who shared their knowledge, insights, and experience, helping make this event a success. Learn more on the thermal chain evolution: http://ms.spr.ly/6045vYtBc #Vertiv #ThermalChampions #AI #ThermalManagement #LiquidCooling #DataCenters #Engineering