Post by The University of Texas at Arlington

As artificial intelligence and advanced computing systems become more powerful, keeping electronic devices cool is becoming one of engineering’s biggest challenges. Supported by UTA’s Research Enhancement Program, Dr. Sally Jia and her team are exploring how advanced materials such as graphene and carbon nanotubes can improve heat transfer inside next-generation computer chips. Their research aims to help future AI processors and electronics run faster, more efficiently and more reliably by reducing the heat buildup that can limit performance. The project could lead to innovations in AI systems, high-performance computing, sensors, flexible electronics and advanced communications technologies. Read more: https://brnw.ch/21x3qDa