Post by TSMC

As AI compute scales, TSMC is at the frontier with leadership silicon. At VLSI 2026, our Senior Fellow and VP of Design and Technology Platform, Dr. L.C. Lu, delivered a keynote highlighting TSMC 3DFabric® integrations and innovations. Through these technologies, we enable 34X to 48X AI bandwidth and compute scaling in one package. We optimize datacenter interconnects by advancing connectivity solutions like 2.5D UCIe and silicon photonics via TSMC-COUPE™ technology. We also overcome thermal and power bottlenecks through design co-optimization and innovations in voltage regulators. Together with ecosystem partners, we leverage 3Dblox and AI-based solutions to automate 3DIC design, ensuring high-performance heterogeneous integration! #TSMC #VLSI2026