Post by TRUMPF

Name: From lithography to advanced packaging – innovation in semiconductors is a team effort. At TRUMPF’
Uploaded: 2026-06-18T06:01:25.154Z
Channel: TRUMPF
Description: From lithography to advanced packaging – innovation in semiconductors is a team effort. At TRUMPF’s education center in Ditzingen, CTO Berthold Schmidt and CEO LT Hagen Zimer discussed with student

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From lithography to advanced packaging – innovation in semiconductors is a team effort. At TRUMPF’s education center in Ditzingen, CTO Berthold Schmidt and CEO LT Hagen Zimer discussed with students and apprentices – moderated by Dr. Manuel Thomä – how we enable the next generation of chips, powered by EUV-related laser systems, plasma technology and global collaboration. Because the next generation matters: it will define how far AI, digitalization and advanced manufacturing can scale. #semiconductors #training #learning

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