Post by Tower Semiconductor
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3š šš š¢š§ššš š«ššš¢šØš§ š¢š¬ š®š§š„šØšš¤š¢š§š š§šš° š„ššÆšš„š¬ šØš š©šš«ššØš«š¦šš§šš. Join Tower Semiconductor at IMS 2026 for a MicroApp presentation demonstrating the RF and EM simulation flow of a multi-process, multi-PDK 3D integrated design targeting Satcom applications. From device concept to full-system simulation, this session will showcase a practical methodology for co-packaged and hybrid-bonded 3D RF systems, highlighting how Tower technologies help simplify design complexity and accelerate development. š Presentation Details: šš¢šš„š: Simulation Methodology for Co-Packaged or Hybrid-Bonded Multi-Technology 3D RF System in a Single Virtuoso Cockpit šš©ššš¤šš«: Chris Masse, Design Automation Engineer, Sr. Principal šššš & šš¢š¦š: Wednesday, June 10th | 10:19ā10:43 AM ššØšššš¢šØš§: MicroApps Theater, IMS Exhibit Hall For more information š https://lnkd.in/deTvQut #IMS2026 #TowerSemiconductor #RFdesign #SiGe #SOI #Satcom #3Dintegration