Post by Technoprobe

Technoprobe is proud to return as a Platinum Sponsor of the Semiconductor Wafer Test Conference (SWTest) 2026, taking place June 8–10 at the Omni La Costa Resort in Carlsbad, California. Join us for a series of insightful presentations showcasing the latest advancements in wafer testing technologies: Key Presentations Monday, June 8 – 11:00 AM Achieving High-Volume Test for Silicon Photonic Devices with a Fully Integrated and Automated Solution Presented by Marvell, Technoprobe, and Teradyne Monday, June 8 – 1:30 PM Micro-Bump Probing for Advanced System-on-Chip Testing: A Preview into Native-Pitch Solutions and Their Challenges Presented by Intel and Technoprobe Tuesday, June 9 – 10:00 AM Next-Generation Thermal Chuck for Improved Temperature Control of Singulated Die Testing Presented by Intel and Technoprobe Wednesday, June 10 – 9:00 AM New 300mm Vertical Probing Solution Enabling Automotive Microcontroller High-Volume Manufacturing and Test Presented by Infineon and Technoprobe Also, please JOIN US on Tuesday, June 9th at 8pm for Technoprobe “Tech to the 80’s” networking party in the Coastal Event Center, Orchid Terrace. Get ready for a fun evening filled with great music, vibrant energy, and a throwback to the iconic 80’s era. See you there!   To learn more about Technoprobe’s latest innovations in micro-bump testing, silicon photonics solutions, DIS Tech FusionLink, and more, be sure to visit booth #512. We look forward to connecting with you at SWTest 2026!