Post by SUSS

Big chips need big masks – and an ecosystem to match. AI hardware demands a new level of integration. As package sizes push beyond 10,000 mm², combining logic, memory, and power components in a single package puts real pressure on lithography and on the tools behind it. At the 41st Mask and Lithography Conference EMLC 2026 in Jena, our colleague Marc Hennemeyer, Director Process Technology Lithography at SUSS, addressed exactly this challenge – and made the case for considering the needs of large-format exposures along the fab logistics chain. Full-field, 1x scanner lithography – like performed by our SUSS DSC300 Gen3 – is a powerful solution for large area lithography. By exposing the entire substrate in a single scan, it eliminates stitching errors and reticle exchanges, delivers higher throughput, and compensates for the scaling deviations typical in reconstituted packaging substrates. But large-format exposures require large-format photomasks. And large-format photomasks require an ecosystem that doesn't fully exist yet: the whole supply chain, like mask handling systems and storage solutions, needs to scale alongside the technology. Because the lithography tool is only one piece of the puzzle – and building the ecosystem around it is a challenge for the entire industry. Thank you to the organizers of EMLC 2026 for the platform, and to everyone who engaged with Marc's presentation. These conversations push the field forward. #SUSS #Semiconductor #GrowingInnovation