Post by Smoltek Investor Relations

Power delivery is moving from the board to underneath the processor » 𝒕𝒐 𝒕𝒉𝒆 𝒑𝒂𝒄𝒌𝒂𝒈𝒆, and eventually as close as possible to the silicon itself.  In that world, 𝐞𝐯𝐞𝐫𝐲 𝐦𝐢𝐜𝐫𝐨𝐦𝐞𝐭𝐞𝐫 𝐦𝐚𝐭𝐭𝐞𝐫𝐬.  A capacitor is no longer useful only because it has high capacitance density; 𝒊𝒕 𝒎𝒖𝒔𝒕 𝒂𝒍𝒔𝒐 𝒇𝒊𝒕 𝒊𝒏𝒕𝒐 𝒆𝒙𝒕𝒓𝒆𝒎𝒆𝒍𝒚 𝒍𝒊𝒎𝒊𝒕𝒆𝒅 𝒗𝒆𝒓𝒕𝒊𝒄𝒂𝒍 𝒔𝒑𝒂𝒄𝒆.  This is where 𝐂𝐍𝐅-𝐌𝐈𝐌 𝐰𝐢𝐧𝐬, most clearly. https://lnkd.in/emyu-Ui4