Post by Siemens EDA (Siemens Digital Industries Software)

The pace of innovation in the semiconductor industry is only getting harder to keep up with. Designs are more complex. Verification cycles are longer. And the pressure to deliver faster, with fewer errors, keeps increasing. That’s exactly why spaces like User2User North America exist. On April 28 in Santa Clara, the Siemens EDA community came together for a full day focused on what’s actually working in today’s design environments, from AI-driven workflows to 3D IC scaling, connected verification, and real-world implementation challenges. And this week, we’ll do it again in Munich. It’s not too late to register! From keynotes with leaders from Arm and NVIDIA to technical sessions from companies like Intel, TSMC, Samsung Semiconductor, and STMicroelectronics, the focus is practical insight you can take back to your own workflows. You’ll get a closer look at topics like: • AI-assisted design and verification workflows • Scaling 3D IC design and advanced packaging • Shift-left strategies across SoC development • Yield, test, and post-silicon validation • Cloud-enabled EDA and high-performance verification If you’re looking to learn, share, and see where the industry is heading next, this is where those conversations happen.

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