Post by Siemens EDA (Siemens Digital Industries Software)

Competing in the increasingly complex semiconductor market requires speed, accuracy and design confidence—and the latest advancements we’re releasing in collaboration with TSMC will help organizations deliver next-generation innovations with these qualities in mind. Collaboration on new AI-powered capabilities, extending across workflows in our Fuse EDA AI System, Calibre software and Aprisa software, will include: • Multi-step, multi-tool automations for IC design • Automated DRC-centric physical verifications • Faster access to design data and guided recommendations • Real-time command execution for accelerated design cycles We’ve also achieved more certifications across the Calibre portfolio, the Solido Simulation Suite and the mPower tool suite, meaning our solutions will now support customers using TSMC’s advanced process technologies, empowering next-generation design across verification, implementation and optimization workflows. Read the full press release, including insights from Ankur Gupta, executive vice president, EDA IC Software, Siemens Digital Industries Software and Aveek Sarkar, director of the ecosystem and alliance management division at TSMC: https://lnkd.in/gWg96xcv