Post by SemiVision

The modern AI data center is increasingly constrained not by compute alone, but by how efficiently bits move between compute nodes, racks, and rows. As cluster sizes grow, electrical links (copper traces, cables, connectors) face hard limits in reach and power at very high speeds—pushing the system toward optical links for an ever-larger share of server–switch and switch–switch connections. This is one reason why co-packaged optics (CPO)—bringing optical engines much closer to the switching/compute silicon—is widely positioned as a next architectural step to reduce electrical loss and improve power efficiency. https://lnkd.in/gz6ThY3H