Post by Semicon Leaders Asia

“The move to 3D architectures and advanced packaging is raising the bar for performance, reliability, and manufacturability across the industry,” said Chuck Xu, President, Interconnect Solutions at Qnity. “ASE’s recognition highlights the role our materials play in enabling next-generation semiconductor packaging.” #QnityElectronics #Semiconductors #AdvancedPackaging #ASE #SupplyChainExcellence #SemiconductorIndustry #MaterialsScience #ChipManufacturing #Innovation #ElectronicsManufacturing https://lnkd.in/dAt6B-QM