Post by scia Systems GmbH

Name: Chip delayering – the controlled, sequential removal of layers in a multi-layer integrated circuit –
Uploaded: 2026-06-15T06:15:01.692Z
Channel: scia Systems GmbH
Description: Chip delayering – the controlled, sequential removal of layers in a multi-layer integrated circuit – is a core step in both failure analysis and reverse engineering workflows. While established method

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Chip delayering – the controlled, sequential removal of layers in a multi-layer integrated circuit – is a core step in both failure analysis and reverse engineering workflows. While established methods have inherent limitations, ion beam etching (IBE) from scia Systems delivers superior precision and broad material compatibility, covering metals, semiconductors, polymers, and ceramics. Want to know more? Further information on chip delayering via ion beam etching: https://lnkd.in/exaaW73M #sciasystems #IBE #IonBeamEtching #FailureAnalysis #ReverseEngineering

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