Post by Schweizer Electronic AG

ENABLING HIGH-EFFICIENCY SiC INVERTERS – A JOINT SHOWCASE AT PCIM Power electronics is evolving rapidly – driven by wide bandgap semiconductors, increasing switching speeds and the demand for higher efficiency and power density. At PCIM Europe, the international meeting point for the power electronics community, experts from across the industry come together to present the latest technologies shaping next-generation power conversion. ROHM Semiconductor Europe, eMoveUs and Schweizer Electronic AG will jointly showcase a SiC-based inverter demonstrator integrating Schweizer’s p² Pack embedding technology. 📍 ROHM Booth | Hall 9, Booth 318 📅 9–11 June 2026 | Nuremberg, Germany At the booth, visitors can explore a demonstrator highlighting a SiC-based inverter architecture, showcasing how advanced semiconductor technology and innovative PCB integration enable highly efficient power electronics for e-mobility applications. With our p² Pack embedding technology, SiC chips can be integrated directly into the PCB structure, enabling: • extremely low parasitic inductance • reduced switching losses • improved thermal paths and higher power density By enabling very short current paths and optimized thermal integration, advanced PCB embedding supports the development of compact and highly efficient SiC inverter solutions. We look forward to meeting customers, partners and industry experts in Nuremberg and discussing the future of power electronics. Learn more: www.schweizer.ag #schweizerelectronicag #schweizer #rohm #semiconductors #emoveus #pcim