Post by SCHOTT

A big thank you to everyone who stopped by our booth at #ECTC2026. It was great catching up with colleagues, customers, and partners, and having so many engaging conversations about the future of advanced packaging. The interest in our glass-based solutions – from glass-core substrates and carrier wafers to co-packaged optics – made this year’s event especially rewarding for our team. One of the highlights was discussing our new co-packaged optics model with Fraunhofer IZM and exploring the role glass can play in enabling next-generation high-performance architectures. We appreciate everyone who took the time to meet with us and share their perspectives throughout the week. We look forward to continuing those conversations after Orlando. See you at the next event!