Post by RENA Technologies GmbH

A huge thank you from RENA Technologies GmbH to everyone who attended our technical presentation at the iTGV Forum! We loved sharing our insights on "Tuning Through-Glass Via (TGV) Shapes in Different Glass Types for Glass-Core Packaging Substrates." As high-density packaging evolves, a key part of this shift is the successful integration of high-density micro-holes, or TGVs. Achieving reliable vertical interconnects requires absolute precision over via shapes. Why partner with RENA? 1. Industry-proven wet processing equipment. 2. Specialized alkaline processing with absolutely no HF. 3. Leading automation capabilities for seamless mass production. Thank you for joining us to discuss and shape the future of high-density packaging.