Post by QuantumDiamonds

𝗤𝗗𝗠 𝗶𝘀 𝗻𝗼𝘄 𝗮𝘁 𝘁𝗵𝗲 𝗰𝗲𝗻𝘁𝗲𝗿 𝗼𝗳 𝘁𝗵𝗲 𝟯𝗗 𝗺𝗲𝘁𝗿𝗼𝗹𝗼𝗴𝘆 𝗺𝗮𝗽 When 郭菓賢 HS K. asked Gemini what was missing from imec's well-known 3D metrology and inspection landscape, the model brought Quantum Diamond Microscopy onto the chart, 𝘀𝗾𝘂𝗮𝗿𝗲𝗹𝘆 𝗶𝗻 𝘁𝗵𝗲 𝗺𝗶𝗱𝗱𝗹𝗲, spanning 3D logic, 3D memory, and 3D interconnects, covering the lateral resolution and probing depth window that matters most for advanced packaging. The annotation says it all: 𝘂𝗻𝗶𝗾𝘂𝗲 𝗺𝗮𝗴𝗻𝗲𝘁𝗶𝗰 𝗰𝗼𝗻𝘁𝗿𝗮𝘀𝘁, the signal channel no other technique on the chart offers. This is the updated map. The previous version did not include quantum sensing at all. Three years ago QDM was a research curiosity. Today a leading US chip designer called it 𝘁𝗵𝗲 𝗺𝗼𝘀𝘁 𝗳𝘂𝗻𝗱𝗮𝗺𝗲𝗻𝘁𝗮𝗹 𝗶𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗶𝗻 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗺𝗲𝘁𝗿𝗼𝗹𝗼𝗴𝘆 𝗶𝗻 𝘁𝗵𝗲 𝗹𝗮𝘀𝘁 𝗱𝗲𝗰𝗮𝗱𝗲. Our QDm.1 is now installed in two failure analysis labs: Eurofins | EAG Laboratories 𝗶𝗻 𝘁𝗵𝗲 𝗨𝗦 and Integrated Service Technology Inc. (iST) 𝗶𝗻 𝗧𝗮𝗶𝘄𝗮𝗻, the first commercial quantum sensing tools in the FA workflow. Nine of the ten largest chipmakers are now engaged with us. The fab impact is coming. Hat tip to HS Kuo for putting the map in front of the right audience.