Post by QuantumDiamonds

𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗙𝗔 𝗰𝗵𝗮𝗹𝗹𝗲𝗻𝗴𝗲𝘀 𝗮𝗿𝗲 𝗿𝗲𝗮𝗰𝗵𝗶𝗻𝗴 𝗘𝘂𝗿𝗼𝗽𝗲, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝘁𝗼𝗼𝗹𝘀 𝗮𝗿𝗲 𝗿𝗲𝗮𝗱𝘆 Last week, our Application Team Lead Bartu Bisgin presented quantum diamond microscopy and our new product QDm.1 at the CAM Workshop in Halle. As we roll out our failure isolation equipment across labs worldwide, the conversations left a few clear impressions about where the field is heading. Advanced packaging, and the analysis it demands, is steadily taking hold in Europe. As heterogeneous integration pilot lines ramp up, the strain on FA tooling grows with them. Alongside that, 𝗖𝗼-𝗣𝗮𝗰𝗸𝗮𝗴𝗲𝗱 𝗢𝗽𝘁𝗶𝗰𝘀 came through as the next frontier, dominating the AI hardware conversation on both the fabless and the foundry side, with Europe firmly in the picture and imec working near the global front. Against that backdrop, quantum diamond microscopy is 𝗳𝗶𝗻𝗱𝗶𝗻𝗴 𝗶𝘁𝘀 𝗺𝗼𝗺𝗲𝗻𝘁: increasingly seen as a credible, emerging answer for FA in complex 2.5D and 3D architectures, and for the CPO inspection challenges coming next. The wider takeaway from Halle was how fast the landscape is shifting, and how quickly new failure analysis approaches are turning from promising to essential for the ecosystem. Want to know what the QDm.1 could mean for your FA workflow? Take a closer look on our website, link in the comments.