Post by QuantumDiamonds
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๐๐ถ๐ฟ๐๐-๐ผ๐ณ-๐ฎ-๐ธ๐ถ๐ป๐ฑ ๐๐ฎ๐ถ๐น๐๐ฟ๐ฒ ๐๐ป๐ฎ๐น๐๐๐ถ๐ ๐ถ๐ป ๐๐๐ถ๐ฎ We are proud to have been part of the first ๐๐๐๐๐ฆ ๐๐ ๐ช๐ผ๐ฟ๐ธ๐๐ต๐ผ๐ฝ ๐ถ๐ป ๐๐๐ถ๐ฎ, hosted by Integrated Service Technology Inc. (iST), one of Taiwan's leading semiconductor service laboratories, in the heart of the global chip industry in Hsinchu. ๐น๐ผ The workshop brought together some of the biggest names in semiconductors, including NVIDIA, Qualcomm, and TSMC, to tackle the most pressing failure analysis challenges of the AI era. As packaging complexity grows, so does the need for ๐ถ๐ป๐๐ฝ๐ฒ๐ฐ๐๐ถ๐ผ๐ป ๐บ๐ฒ๐๐ต๐ผ๐ฑ๐ ๐๐ต๐ฎ๐ ๐ฐ๐ฎ๐ป ๐๐ฒ๐ฒ ๐ถ๐ป๐๐ถ๐ฑ๐ฒ ๐ถ๐. Our CTO, Fleming Bruckmaier, presented how Quantum Diamond Microscopy enables ๐ป๐ผ๐ป-๐ฑ๐ฒ๐๐๐ฟ๐๐ฐ๐๐ถ๐๐ฒ ๐ณ๐ฎ๐๐น๐ ๐น๐ผ๐ฐ๐ฎ๐น๐ถ๐๐ฎ๐๐ถ๐ผ๐ป ๐๐ต๐ฟ๐ผ๐๐ด๐ต ๐บ๐ฎ๐ด๐ป๐ฒ๐๐ถ๐ฐ ๐ฐ๐๐ฟ๐ฟ๐ฒ๐ป๐ ๐ฝ๐ฎ๐๐ต ๐ถ๐บ๐ฎ๐ด๐ถ๐ป๐ด, helping FA teams localize defects inside optically opaque, increasingly complex package architectures. Learn more via the link in the comment section. ่ฌ่ฌ to EDFAS and iST for making this possible, and to every team that joined the conversation. This is exactly where QD wants to be: on the front lines with the people setting the gold standard for semiconductor failure analysis.