Post by Siemens Electronic Systems Design & Manufacturing

ELT Group's military PCB packs high-speed digital, analog, and RF into a compact 18-layer board using two asymmetrical buildups to keep each section isolated. The team designed the stackup and verified signal integrity in HyperLynx, laid out the board in Xpedition, and validated manufacturing compliance in Valor NPI. Working closely with their fabricator, they pushed HDI technology to achieve 3 mil traces and spaces with 6 mil drill holes — implementing waveguides and via stitching in the RF sections while meeting IPC Class 3 requirements throughout.