Post by Nouryon

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What if adhesives hold strong and then let go exactly when you want them to? At FoamExpo North America, we’ll be discussing how Expancel® microspheres enable thermal debonding — and how precision in temperature response is shaping what’s possible in temporary bonding. Across advanced manufacturing — from electronics assembly to multi-material structures — performance is no longer just about bond strength. It’s about control over when it comes apart. With Expancel® microspheres, bonding remains strong during processing, then releases cleanly when heat is applied. 👉 Join us at FoamExpo North America to see what this enables. Visit the event page: https://ow.ly/S8Ub50Z9gog #FoamExpo #Adhesives #ThermalDebonding #Expancel #Nouryon

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