Post by Nikon SLM Solutions

𝗡𝗲𝘄 𝗰𝗮𝘀𝗲 𝘀𝘁𝘂𝗱𝘆: 𝗵𝗼𝘄 𝗮 𝟯𝗗-𝗽𝗿𝗶𝗻𝘁𝗲𝗱 𝗲𝘃𝗮𝗽𝗼𝗿𝗮𝘁𝗼𝗿 𝗶𝘀 𝗵𝗲𝗹𝗽𝗶𝗻𝗴 𝘀𝗼𝗹𝘃𝗲 𝗱𝗮𝘁𝗮 𝗰𝗲𝗻𝘁𝗲𝗿 𝗰𝗼𝗼𝗹𝗶𝗻𝗴 𝗹𝗶𝗺𝗶𝘁𝘀. Data centers are hitting a thermal wall. GPU power draw has surpassed 1000 watts per processor, and traditional air cooling can no longer keep up. Under the EU-backed AM2PC project, DTI worked with Heatflow ApS, OpenEngineering, and Fraunhofer IWU to design a solution: a single-piece aluminum evaporator for passive two-phase cooling, built on Nikon SLM Solutions' SLM®280 platform. The results:  • 600W of cooling capacity, 50% above the original 400W target  • No pumps or fans required  • Heat extracted at 60-80°C, warm enough for direct reuse in district heating or industrial processes  • A single-piece design that eliminates the assembly points and leak risk of conventional multi-part cooling hardware As Simon Brudler, Senior Consultant at DTI, put it: "By 3D printing the component in aluminum, we can integrate all necessary functions into a single part. This eliminates assembly points, reduces the risk of leaks, and makes the component more reliable. At the same time, we use only one material, which makes it easier to recycle." Read the full case study: https://lnkd.in/dq96DSHW #AdditiveManufacturing #MetalPrinting #DataCenters #ThermalManagement