Post by Nexperia

Down to the atom – Hunting chip defects with DESY   A recent article in Handelsblatt explored our unique collaboration with the renowned DESY research center in Hamburg, which aims to push the limits of silicon carbide (SiC) semiconductor technology. By applying advanced 3D X-ray microscopy with Germany’s largest particle accelerator, the teams can analyze crystal defects at the atomic level.   “Ultimately, it’s about making SiC more affordable and more powerful,” explains Ansgar Thorns, VP R&D at Nexperia   SiC technology is essential for the next generation of electric vehicles and energy-efficient systems. Global demand for SiC chips is set to rise dramatically, and reducing defects is key to ensuring a scalable and sustainable supply. Although we entered the SiC field later than some competitors, this bold partnership with DESY shows our commitment to accelerating innovation and strengthening Hamburg’s role as a semiconductor production hub. With €175 million (~$200 million) invested in expanding our local fab, we’re helping secure Europe’s industrial competitiveness while contributing to knowledge that will benefit the wider industry.   As DESY CTO Arik Willner noted, “Such deep insights have not existed until now.” By making these findings broadly available, the collaboration will also support the development of digital twins and new quality standards for SiC manufacturing.   Thank you to Handelsblatt for highlighting what’s possible when German engineering, science, and industry collaborate to drive sustainable innovation forward.   Link to the paywalled article in German - https://lnkd.in/eJchwM6S