Post by Merck Electronics

As advanced packaging architectures get more complex, we’re focused on helping customers translate that complexity into performance—by strengthening and continuing to invest in the capabilities that matter most on the fab floor. As Al Chuang, our Global Head of Planarization, shares below: we’re doubling down where it counts to support our customers’ next-generation packaging roadmaps. Learn more about our offerings at Planarization: https://lnkd.in/eEeqrzre #AdvancedPackaging #Semiconductors #MaterialsScience #CMP #Innovation #NewELEC