Post by LIGENTEC

The next frontier in high-speed modulation is here—and it's built on silicon nitride. At SPIE Photonics Europe 2026, Camiel Op de Beeck will present an invited paper on integrating thin-film lithium niobate (TFLN) and lithium-tantalate modulators directly onto LIGENTEC's low-loss SiN photonics platform via wafer-bonding. What this means in practice: → High-speed, low-insertion-loss modulators on a mature, scalable SiN technology → A clear path toward volume fabrication—not just lab demonstrations → Device innovations targeting wider bandwidth and lower drive voltage This is heterogeneous integration delivering real, manufacturable results. 📍 Catch the talk: Tuesday, April 14 | 08:30–09:00 CEST | Boston/Salon 11, Level 1 🌐 Learn more about our platform: https://lnkd.in/e4J6uxVi 📧 Schedule a meeting in Strasbourg: [email protected] #SPIEPhotonicsEurope #SiliconNitride #IntegratedPhotonics