Post by LIGENTEC

TOMORROW AT 12:55 PM | Don't let scalability stall your 2026 roadmap. Scaling photonic integration from lab prototype to high-volume deployment is a notorious hurdle. The fix? Heterogeneous integration on a low-loss Silicon Nitride (SiN) platform. Catch Michael Geiselmann, Ph.D. (President & CCO of LIGENTEC) tomorrow at the Photonics Spectra Integrated Photonics Summit! He will break down how combining high-speed TFLN modulation (>120 GHz), photodetection, and comb lasers is now highly manufacturable within an automotive-qualified foundry environment. 🎟️ Secure your free spot before tomorrow's session! 👉 Register Here: https://lnkd.in/e7aRxqbe #PhotonicsSpectra #IntegratedPhotonicsSummit #PhotonicIntegration #SiliconNitride #TFLN