Post by LIGENTEC

Yesterday at the 11th PIC International Conference in Brussels, our Co-Founder & CCO Michael Geiselmann took the stage to share LIGENTEC's vision for the future of photonic integration. In his talk — "Advancing Scalable Photonic Integration: Heterogeneous Integration of Active Components for Next-Generation Applications" — Michael explored how combining diverse materials with active components is revolutionizing PIC design. Key highlights from the presentation: 🔹 Wafer-scale assembly enabling high-speed modulators and photodetectors on ultra-low-loss SiN platforms 🔹 Propagation losses below 0.2dB/m, unlocking performance for the most demanding use cases 🔹 Integration of TFLN and InP on SiN for high speed modulation and detection 🔹 Applications spanning Sense, Connect, Compute The conversation around heterogeneous integration is no longer a question of "if" — it's a question of "how fast." PIC Magazine & PIC International Conference wraps up today in Brussels. If you're still on-site and want to connect with Michael or our team, reach out at [email protected] — we'd love to chat about your next SiN design. #PICInternational #SiliconNitride #PhotonicIntegration #HeterogeneousIntegration