Post by Laboratory of Nano and Quantum Engineering

New automatic wire bonder for electrically connecting the smallest components and contacts There is a new wire bonder in the cleanroom of the Laboratory of Nano and Quantum Engineering (LNQE). The wire bonder is an automatic thermosonic wedge & ball bonder from TPT, model HB100. The HB100 is part of the new generation of automatic benchtop wire bonding systems. It performs wedge and ball bonding as well as ribbon and bump bonding using a single bonding head. The HB100 is very easy to operate thanks to its touchscreen and joystick. Features of the TPT HB100 wire bonder: - Automatic Thermosonic Wedge & Ball Bonder - Motorized Z, X, Y, and R axes - Max. travel range: 100 mm x 100 mm x 100 mm - Ultrasound: 63.3 kHz, up to 10 W - For ball-wedge, wedge-wedge, bump, and ribbon applications - Bonding wires from 12 to 75 µm - Ribbon up to max. 25 µm x 250 µm - Bonding force: from 10 to 200 cN - Includes -- Flex Arm microscope with Olympus SZ51-60 -- Heated substrate holder, height-adjustable, 100 mm x 100 mm, up to 250°C -- Pattern recognition -- Cameras for top and side views The wire bonder is funded by the Federal Ministry of Research, Technology and Aerospace (Bundesministerium für Forschung, Technologie und Raumfahrt (BMFTR)) as part of the ATIQ joint project (“Quantum Computers with Stored Ions for Applications”) and was procured by the research group led by Prof. Dr. Christian Ospelkaus (Institute for Quantum Optics at Leibniz University Hannover & the Physikalisch-Technische Bundesanstalt). The device description for the wire bonder is listed on the LNQE website under Technology in the LNQE Research Building. Jacob Stupp, Oliver Kerker