Post by Laboratory of Nano and Quantum Engineering

New automatic wafer saw for the precise cutting of wafers and substrates in the Laboratory of Nano and Quantum Engineering The new automatic wafer saw is a state-of-the-art DISCO wafer saw, model DAD3351. This wafer saw can be used to separate wafers up to 8 inches (200 mm) in size, made from silicon, quartz glass, sapphire and other materials, into small chips or dies. Features of the DISCO DAD3351 wafer saw: - 1,800 W synchronous spindle with max. 60,000 rpm - Hub mount and hubless mount for 2-inch saw blades - Chuck and frame holder for wafers up to 200 mm - 2 digital microscopes with field of view sizes of 0.64 mm x 0.64 mm and 4.8 mm x 4.8 mm - Manual, semi-automatic and automatic modes - Circle Cut option - Manual Wafer Mounter P-200 - UV Curing Systems U-200 The wafer saw is funded by the funded by the Federal Ministry of Research, Technology and Aerospace (Bundesministerium für Forschung, Technologie und Raumfahrt (BMFTR)) as part of the MIQRO joint project (“Scalable quantum computer with high-frequency-controlled stored ions”) and procured by the research group led by Prof. Dr. Christian Ospelkaus (Institute of Quantum Optics at Leibniz Universität Hannover & the Physikalisch-Technische Bundesanstalt). Jacob Stupp, Oliver Kerker