Post by Keiron printing technologies

After sharing demos, reactions, and highlights from 𝐈𝐏𝐂 𝐀𝐏𝐄𝐗 𝐄𝐗𝐏𝐎 2026, one conclusion stands out for the team at 𝐊𝐞𝐢𝐫𝐨𝐧 𝐏𝐫𝐢𝐧𝐭𝐢𝐧𝐠 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐞𝐬: 𝐀𝐈 𝐢𝐬 𝐜𝐡𝐚𝐧𝐠𝐢𝐧𝐠 𝐭𝐡𝐞 𝐫𝐞𝐪𝐮𝐢𝐫𝐞𝐦𝐞𝐧𝐭𝐬 𝐟𝐨𝐫 𝐞𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜𝐬 𝐦𝐚𝐧𝐮𝐟𝐚𝐜𝐭𝐮𝐫𝐢𝐧𝐠 𝐟𝐚𝐬𝐭𝐞𝐫 𝐭𝐡𝐚𝐧 𝐞𝐯𝐞𝐫. The next generation of AI advanced packages requires 𝐭𝐡𝐨𝐮𝐬𝐚𝐧𝐝𝐬 — 𝐬𝐨𝐦𝐞𝐭𝐢𝐦𝐞𝐬 𝐦𝐨𝐫𝐞 𝐭𝐡𝐚𝐧 10,000 — 𝐬𝐨𝐥𝐝𝐞𝐫 𝐣𝐨𝐢𝐧𝐭𝐬, each needing extremely precise solder paste volumes. Supporting these applications means being able to print 𝐭𝐡𝐨𝐮𝐬𝐚𝐧𝐝𝐬 𝐨𝐟 solder paste deposits 𝐰𝐢𝐭𝐡 𝐧𝐚𝐧𝐨𝐥𝐢𝐭𝐞𝐫-𝐥𝐞𝐯𝐞𝐥 𝐩𝐫𝐞𝐜𝐢𝐬𝐢𝐨𝐧 — something that pushes many traditional processes beyond their limits. Another big takeaway from APEX was the 𝐬𝐭𝐫𝐞𝐧𝐠𝐭𝐡 𝐨𝐟 𝐭𝐡𝐞 𝐭𝐞𝐚𝐦. For two and a half days the booth was constantly busy. The team moved between machine demonstrations, software demos, and in-depth conversations with visitors — supporting each other and keeping everything running smoothly. And perhaps the most encouraging signal from the market: Visitors didn’t just find the technology interesting — 𝐦𝐚𝐧𝐲 𝐰𝐚𝐧𝐭 𝐭𝐨 𝐢𝐦𝐩𝐥𝐞𝐦𝐞𝐧𝐭 𝐢𝐭. Engineers and executives talked about integrating it into their production lines and preparing their factories for the next generation of electronics. A big thank you to everyone who visited the booth, challenged us with technical questions, and shared their perspectives. 🎬 In this video, our team shares their final takeaways from APEX. #APEXEXPO #AI #ElectronicsManufacturing #SMT #Innovation #DeepTech #DigitalManufacturing #Keiron #LiFTtechnology

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