Post by Keiron Printing Technologies

🤖 𝐀𝐈 𝐧𝐞𝐞𝐝𝐬 𝐩𝐨𝐰𝐞𝐫𝐟𝐮𝐥 𝐜𝐡𝐢𝐩𝐬. 𝐁𝐮𝐭 𝐜𝐡𝐢𝐩𝐬 𝐧𝐞𝐞𝐝 𝐩𝐞𝐫𝐟𝐞𝐜𝐭 𝐬𝐨𝐥𝐝𝐞𝐫 𝐣𝐨𝐢𝐧𝐭𝐬. At 𝐈𝐏𝐂 𝐀𝐏𝐄𝐗 𝐄𝐗𝐏𝐎 2026, one topic kept coming up during demonstrations at the 𝐊𝐞𝐢𝐫𝐨𝐧 𝐏𝐫𝐢𝐧𝐭𝐢𝐧𝐠 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐞𝐬 booth: 𝐀𝐈 𝐡𝐚𝐫𝐝𝐰𝐚𝐫𝐞. Modern High Complex boards can contain AI Advanced Packages with 𝐭𝐡𝐨𝐮𝐬𝐚𝐧𝐝𝐬 — 𝐬𝐨𝐦𝐞𝐭𝐢𝐦𝐞𝐬 𝐦𝐨𝐫𝐞 𝐭𝐡𝐚𝐧 10,000 — 𝐬𝐨𝐥𝐝𝐞𝐫 𝐣𝐨𝐢𝐧𝐭𝐬. Manufacturing these reliably is becoming one of the biggest challenges in electronics assembly. During the demos, visitors quickly realized something: 👉 Without breakthroughs in SMT processes, scaling AI hardware becomes much harder. We often hear: “𝘞𝘪𝘵𝘩𝘰𝘶𝘵 𝘈𝘚𝘔𝘓, 𝘯𝘰 𝘈𝘐.” But when it comes to assembling the boards themselves, the industry reaction at APEX suggested another thought: 𝐖𝐢𝐭𝐡𝐨𝐮𝐭 𝐊𝐞𝐢𝐫𝐨𝐧, 𝐧𝐨 𝐀𝐈 𝐨𝐧 𝐏𝐂𝐁 𝐛𝐨𝐚𝐫𝐝𝐬. Many visitors told us they had never seen anything like LiFT precision solder paste printing before. The most common reactions? 👍 “𝘍𝘢𝘯𝘵𝘢𝘴𝘵𝘪𝘤.” 👍 “𝘈 𝘳𝘦𝘢𝘭 𝘣𝘳𝘦𝘢𝘬𝘵𝘩𝘳𝘰𝘶𝘨𝘩.” 👍 “𝘞𝘰𝘸… 𝘵𝘩𝘪𝘴 𝘧𝘦𝘦𝘭𝘴 𝘭𝘪𝘬𝘦 𝘵𝘩𝘦 𝘧𝘶𝘵𝘶𝘳𝘦.” What excited people most was seeing a technology that can 𝐫𝐞𝐦𝐨𝐯𝐞 𝐭𝐡𝐞 𝐥𝐢𝐦𝐢𝐭𝐚𝐭𝐢𝐨𝐧𝐬 𝐨𝐟 𝐬𝐭𝐞𝐧𝐜𝐢𝐥 𝐩𝐫𝐢𝐧𝐭𝐢𝐧𝐠 and support the next generation of highly complex electronics. For many engineers and executives at the show, the conclusion was clear: 𝐓𝐡𝐢𝐬 𝐢𝐬 𝐭𝐡𝐞 𝐟𝐮𝐭𝐮𝐫𝐞 𝐨𝐟 𝐒𝐌𝐓. 🎬 Watch the video to hear what people said after seeing the technology. #AI #ElectronicsManufacturing #SMT #DigitalManufacturing #Innovation #DeepTech #Keiron #WhyCompromise

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