Post by imec

Press release - imec advances its 300mm RF silicon interposer into a system-level platform for the heterogeneous integration of III-V chiplets on Si-CMOS. The platform uniquely combines high-density embedded capacitors, a scalable passive modeling framework, and laser-assisted bonding for III-V chiplet assembly. Together, these innovations support next-generation mmWave and sub-THz wireless systems and RF-grade signal handling for ultrafast data center applications. Read more: https://lnkd.in/e7XdMqMH