Post by imec

Press release - At the IEEE/JSAP Symposium on VLSI Technology & Circuits, imec, ASML and TSMC present a robust and scalable 300mm integration approach for 2D-material based transistors. For the first time, scaled nFETs and pFETs with a 50nm contacted poly pitch (CPP) have been demonstrated with strong current-voltage characteristics, representing a crucial step in the lab-to-fab transition of 2D-material based transistors. Read more: https://lnkd.in/ewJeVJ8A