Post by imec

As AI systems continue to scale, so do the demands on communication and packaging technologies. Next week, imec will be at the IEEE Optical Interconnects and Packaging (OIP) Conference 2026 in Fort Collins, USA, contributing to the discussion on the future of high-density optical interconnects and packaging. In an invited presentation, Yoojin Ban will share imec’s latest R&D advances in Ge/Si devices for co-packaged optics (CPO) and future 3D Optical I/O, including our vision for wafer-level optical interconnects and recent results in advanced optical die-to-wafer assembly. Join us to explore how these innovations can help enable the next generation of AI infrastructure. 📍 June 15–17 | Fort Collins, USA | More info: https://lnkd.in/eXpzbvHD #IEEEOIP