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𝗔𝗜 𝘀𝗰𝗮𝗹𝗶𝗻𝗴 𝗻𝗲𝗲𝗱𝘀 𝗮 𝗻𝗲𝘄 𝗽𝗹𝗮𝘆𝗯𝗼𝗼𝗸. As AI workloads continue to grow in scale and complexity, the next leap in compute efficiency won't come from transistor scaling alone. It will require innovation across the entire compute stack, from algorithms and architectures to devices, packaging and system integration. That's the premise of a recent Semiconductor Engineering article featuring insights from imec. It explores why the future of AI scaling depends on a holistic approach, a vision that closely aligns with imec's Cross Technology Co Optimization (XTCO) program to help unlock the next generation of energy efficient AI systems. No single breakthrough will define the next era of AI. Progress will come from connecting innovations across disciplines and technologies. Read the article to explore why creating a Moore's Law for AI calls for a fundamentally new approach to scaling ➡️ https://lnkd.in/gr6xiFd9. #AI #XTCO

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