Post by Global Marketing Services, India

Beyond Surface Inspection: Seeing What Electrical Tests Can't In advanced semiconductor packaging, many critical failures start at material interfaces — not as electrical faults, but as mechanical ones. Delamination, mold compound voids, and interfacial cracking alter acoustic impedance long before they show up as measurable failures. In "Motivating Automated Multimodal Failure Analysis for Heterogeneously Integrated Devices," researchers ran a commercial NVIDIA Tesla P100 package through Nordson Scanning Acoustic Microscopy (115 MHz transducer). SAM successfully localized delamination between encapsulant and lead interconnects, mold compound voids, and horizontal cracks — non-destructively, and fast enough to guide downstream X-ray inspection to the right regions of interest. One caveat the study flags: SAM's reliability varies by interface die-to-die-attach interconnections in particular can be hard to resolve acoustically, which is why it works best as part of a broader FA strategy, not a standalone technique. As packaging moves toward 2.5D/3D integration — interposers, TSVs, chiplets, hybrid bonding — more failures originate at these buried interfaces. SAM remains one of the few non-destructive ways to see them directly. 📖 Full paper: https://lnkd.in/gbRR3Wvd 📩 Learn more about Nordson SAM systems: [email protected] #ScanningAcousticMicroscopy #Nordson #AdvancedPackaging #FailureAnalysis #HeterogeneousIntegration #TSV #Chiplets #ReliabilityEngineering Kishore M.M.C Abhijit Maddula Sanjay Bisht CHANDAN PARMAR Dr. Parvez Akhtar Deepti Totaganti