Post by Garal Das

#Fraunhofer_IZM : #Through_Silicon_Vias – a 3D Electronic Packaging Technology by : Thomas Fritzsch, Piotr Mackowiak, Kai Zoschke Fraunhofer IZM, Berlin, Dept. Wafer Level System Integration2022 Source : https://lnkd.in/g8KGzgDn [ #Fraunhofer_IISB 38 Slides : https://lnkd.in/gKPh-M-u) : 09/2016 Challenges and #Simulation_Solutions for #Advanced_Lithography for #Nanometer_Interconnect_Patterning by : P. Evanschitzky ] [ 25 Slides : https://lnkd.in/gZkPYmPF) : 2016 #TSV in #IC_Packaging: Now and Future by : Mike Ma, Ph.D./ Vice President, SPIL ] [ #NTU 32 Slides : https://lnkd.in/dBgX5HVP) : 23/01/2025 #Via_Fabrication with #Multi_Row_Guiding_Templates Using #Lamellar_DSA Presenter: Yun-Na Tsai Advisor: Shao-Yun Fang ] [ #CUHK/ #UT : 37 Slides : https://lnkd.in/dQB5Ydj2) : 2016 Concurrent Guiding Template Assignment and #Redundant_Via-Insertion for #DSA_­MP #Hybrid_Lithography Jiaojiao Ou/ Bei Yu/ David Z. Pan ] [ 43 Slides : https://lnkd.in/gQcGPq5G) : 2020 #Via_Pillar-aware #Detailed_Placement by : Yong Zhong &.. National Taiwan University of Science and Technology ] [ #SEMATECH : 33 Slides : https://lnkd.in/gPihmjxX) : 2009 Basics Of #Through_Silicon_Vias by : Sitaram Arkalgud PhD Director – Interconnect ] [ 21 Slides : https://lnkd.in/gpENj6zR) : 2010 BASICS : #Through_Silicon_Via Technology by : Paul Siblerud Semitool V.P. ElectroChemical Deposition EMC3D Consortium ] [#IBM/ #Fractilia : 25 Slides : https://lnkd.in/gHwpwvrd) : SPIE 2025 #Predicting & #Measuring #Scummed_Contact_Holes ] [ Thesis : 276pgs : https://lnkd.in/gjdehSaD) : 2018 #Electromagnetic_Modeling and Optimization of #Through_Silicon_Vias von David Dahl ] [ 40pgs : https://lnkd.in/gyj6aR9U) : 2020 Tutorial on #Forming #Through_Silicon_Vias ( #TSVs) by : Susan L. Burkett ] [ 12pgs : https://lnkd.in/g85QBqKT) : 22/11/2023 #Spectroscopic_Reflectometry for Optimizing #3D (#TSV) #Through_Silicon_Vias Process by : Yi-Sha Ku ] [ 24 Slides : https://lnkd.in/gqB5D83j) : 2009 #Reliability_Aware #Through_Silicon_Via Planning for #3D_Stacked_ICs.  by : Amirali Shayan &.. ] [ #GF &.. : 20 Slides : https://lnkd.in/gwUqbnAy) : 2012 #Block_Level #3D_IC_Design  with #Through_Silicon_Via Planning.  by : Dae Hyun Kim &... ] [ 33 Slides : https://lnkd.in/gv-dH8ef) : 2013 #CAD Tools for #3D_IC and #TSV_Based designs by : Kholdoun TORKI] [ https://lnkd.in/dDCVXKz3) : 30/06/2022 : #Scaling the #BEOL – a toolbox filled with new processes, boosters and conductors Extending #Interconnects towards the #3nm technology node and beyond requires several innovations.  #Imec sees single-print EUV in #DualDamascene modules,  #Supervia structures, #SemiDamascene modules and  added functionality in the back-end-of-line (#BEOL) as the way forward. ] [https://lnkd.in/eWjy4f_f) Extending #Copper #Interconnects To #2nm : 17/03/2022 :  From #LowResistance #Vias to #Buried #PowerRails, it takes multiple strategies to usher in #2nm chips. - By: Laura Peters]