Post by Garal Das
EX Student OF HIT : AN ORDINARY TECH ENTHUSIAST. " THE GOAL OF TECHNOLOGY IS TO CONQUER DEATH " - Martine Rothblatt
The #Business of #Making_Chiplets and associated systems by : Anu Ramamurthy : 2025 Associate Technical Fellow, Microchip Co-lead Open Chiplet Economy, OCP Source : https://lnkd.in/gTcvbMnt ***[ 28 Slides : https://lnkd.in/g62qbQhx) : 21/01/2025 #3D_IC #Design_Kits for #Drop_in_Chiplets : MDK, ADK, TDK by : James Wong, Palo Alto Electron David Ratchkov, Thrace Systems ] ***[ #Meta/ #Siemens/ #Georgia : 38 Slides : https://lnkd.in/geuz5fg6) : Paper :23 April 2025 : Slides ; 19/06/2022 #Glass_Interposer Integration of #Logic and #Memory #Chiplets: #PPA and #Power/ #Signal_Integrity Benefits by : Pruek Vanna-iampikul, Serhat Erdogan, Mohanalingam Kathaperumal,Madhavan Swaminathan, and Sung Kyu Lim, Georgia Institute of Technology Ram Gupta, Ravi Agarwal, Meta Praveen Anmula, Kevin Reinbold, Siemens ] ****[ #EVG : 18 Slides :https://lnkd.in/gScP7WeJ) : 18/06/2025 #Fusion & #Hybrid_Bonding: Trends, Challenges and #Prospects Markus Wimplinger Corporate Technology Development & IP Director ] ***[ #TSMC : 14 Slides : https://lnkd.in/gbW3Tgek) : 5th August 2025 #Advanced_CPO Integrated by #CoWoS ® and #COUPE by : S. Y. Hou, TSMC ] [ GF : 15 Sldes : https://lnkd.in/gVM4yd24) : 12/01/2024 #Silicon_Photonics : A #Foundry and #Ecosystem View by : Vikas Gupta : Senior Director : Product Management : Global Foundries *****[ Thesis : 172pgs : https://lnkd.in/gcdjc-bs) : 11/2017 Fine Pitch #3D_Integration Using #Self_Aligned_Assembly by : Vikas Dubey ] [ 137pgs : https://lnkd.in/gCvZeVFG) : 2017 #Heterogeneous_Integration Technology by : Dr. Burhan Bayraktaroglu] [ 17 Slides : https://lnkd.in/gU_9FSRi) : 11 th Sep 2024 #Photonic_Fabric based Scale-Up Network for #Chip_to_Chip & #Chip_to_Memory Connectivity by : Preet Virk Co-Founder & COO, Celestial AI ] [ 112pgs : https://lnkd.in/gEPPj7zD) : 12/2025 #SIP_Integration for an Octa-Channel #Bio_SoC for #Wireless_BCI by : Dipl.-Ing &..] [ #Synopsys : 17 Slides : https://lnkd.in/gBrbB6ir) : 2010 Efficient #Design_Practices for #Thermal_Management of #TSV_Based #3D_IC System by : Min Ni, Qing Su, Zongwu Tang, Jamil Kawa]
