Post by Fraunhofer Institute for Photonic Microsystems IPMS

#Throwback – Three days of hands-on collaboration, process development, and valuable exchange.   Together with Black Semiconductor, we spent three intensive days in our cleanroom developing and optimizing individual dry and wet etching processes for photonic devices. The wafers and materials were provided by BlackSemi, and we worked side by side to evaluate etching performance, optimize process parameters, and characterize the results.   💡 To facilitate the transition from 200 mm to 300 mm wafers, we used "FlexFrame" wafer carriers (wafer clamps) specially developed to enable seamless handling of 200 mm wafers in in 300 mm tools. This allows customers to benefit from advanced 300 mm process capabilities while working with smaller wafer formats.   👌 This kind of close collaboration between research and industry is what drives innovation: combining application-specific requirements with cleanroom expertise to develop tailored process solutions.   A big thank you to our partner for the trust and the great teamwork. We look forward to continuing our collaboration on future photonic innovations. 🤝 --- Dominik Metzler - Stephen Boandoh - Margarita L. - Abhishek Vatsal - Matthias Rudolph - Jonathan Kottmeier - Marcus Wislicenus - #FraunhoferIPMS - #photonics - #PIC - #cleanroom - #Dresden - #research - #innovation