Post by Fraunhofer Institute for Photonic Microsystems IPMS

Europe needs faster ways to turn advanced semiconductor research into scalable technologies for industry. This is exactly where the APECS Pilot Line comes in. The European Pilot Line helps companies connect different chip technologies, components and functions into smarter, more compact and more powerful systems. For industry partners, this means access to technologies, processes and expertise that can support the path from idea to application. We at Fraunhofer IPMS contribute expertise in: ⚙️ 𝗖𝗵𝗶𝗽𝗹𝗲𝘁 𝘀𝘆𝘀𝘁𝗲𝗺 𝗱𝗲𝘀𝗶𝗴𝗻: We build innovative system architectures for computing, artificial intelligence and MEMS sensors/actuators ⚙️ 𝗖𝗵𝗶𝗽𝗹𝗲𝘁 𝗶𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗶𝗼𝗻:  Technologies on 200 and 300 mm wafers, including 3D stacking and 2.5D wafer-level integration, ultra-high density functional interposers and CMOS and MEMS/non-silicon chiplets ⚙️ 𝐈𝐂 𝐝𝐞𝐬𝐢𝐠𝐧 𝐰𝐢𝐭𝐡 𝐛𝐮𝐢𝐥𝐭-𝐢𝐧 𝐟𝐮𝐧𝐜𝐭𝐢𝐨𝐧𝐚𝐥 𝐬𝐚𝐟𝐞𝐭𝐲: We are developing design flows for the modeling of IP cores which we are implementing using our RISC-V and TSN IP cores Discover more about us in the APECS Pilot Line: 🌐https://lnkd.in/dBKycxmG Also, if you'd like to meet and discuss this in person, why not join the FIRST conference in September? 🌐 https://first-by-fmd.de --- with FMD - Forschungsfabrik Mikroelektronik Deutschland #FraunhoferIPMS #Microelectronics #APECS #AdvancedPackaging #HeterogeneousIntegration #Chiplets #Semiconductors #ChipsAct #SystemIntegration #Innovation #whatsnext

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