Post by Fraunhofer IIS, Division Engineering of Adaptive Systems

🔍 How do we build a functional #chiplet system in the European context that enables us to explore and validate new integration concepts? A recent visit to our Fraunhofer IIS site in Dresden gave us the opportunity to share exactly that.   As part of the Chiplet4Future project, substrate technology from the project consortium was used to realize our automotive chiplet demonstrator featuring a Bunch of Wires (BoW) interface. This substrate serves as the mechanical and electrical foundation of the system, enabling the integration and interconnection of the individual chiplets within the demonstrator.   🧩 𝗪𝗵𝗮𝘁 𝘄𝗲 𝗰𝗮𝗻 𝗱𝗲𝗺𝗼𝗻𝘀𝘁𝗿𝗮𝘁𝗲 𝘄𝗶𝘁𝗵 𝘁𝗵𝗲 𝗳𝗶𝗻𝗮𝗹 𝗱𝗲𝗺𝗼𝗻𝘀𝘁𝗿𝗮𝘁𝗼𝗿 ▪️ Multiple chiplets integrated into a single system ▪️ A Bunch of Wires (BoW) interface enabling efficient chiplet-to-chiplet communication ▪️ An advanced substrate serving as the carrier and interconnect platform ▪️ A complete demonstrator platform used for research, integration studies, and evaluation ▪️ A chiplet integration platform targeting advanced automotive applications, such as Advanced Driver Assistance Systems (ADAS)   🔧 𝗪𝗵𝘆 𝘁𝗵𝗶𝘀 𝗺𝗮𝘁𝘁𝗲𝗿𝘀 Chiplet4Future aims to explore how chiplet‑based architectures can be realized in practice. The demonstrator allows us to study system behavior, interface operation and substrate‑level integration under realistic conditions.   ➡️ 𝗪𝗵𝗮𝘁’𝘀 𝗻𝗲𝘅𝘁 We continue our collaboration within Chiplet4Future to further develop and evaluate chiplet‑based system concepts. This work helps us to better understand how chiplet systems can be built and tested in real‑world research environments.   More information: https://lnkd.in/dM9RCp5e Andy Heinig