Post by everything RF

imec, a world-leading research and innovation hub in advanced semiconductor technologies, is evolving its 300mm RF silicon interposer into a system-level platform for the heterogeneous integration of III-V chiplets on Si-CMOS. By uniquely combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems, as well as RF-grade signal handling for ultrafast data center applications. Read more - https://ow.ly/y7IP50ZbL0p #siliconinterposer #RF #CMOS #semiconductors #silicon