Post by Evatec AG

The demand for larger, faster, and more efficient packaging is growing rapidly. At the 3D & Systems Summit 2026 by SEMI Europe in Dresden, Evatec will present how panel-level PVD and DRIE solutions are meeting this challenge.   Mohamed Elghazzali, Manager Technology Development & Advanced Packaging Program, will present how Evatec's panel-level PVD cluster solution enables reliable, high-throughput metallization on large-area glass and polymer substrates, a key enabler for next-generation fan-out panel-level packaging (FOPLP) and heterogeneous integration.   The talk will also cover deep reactive ion etching (DRIE) of vias in organic substrates, combining atmospheric degassing, plasma treatment, in-situ cleaning, and sputter deposition in a single integrated platform, designed for scalable, energy-efficient AI and HPC chiplet packages.   🎤 Advanced Panel Processing for Heterogeneous Integration on Large-Area Substrates 📅 June 18 | 2:05 PM 📍 Hilton Dresden Hotel, Dresden, Germany #TheThinFilmPowerhouse #3DSummit #FOPLP #PVD #DRIE