Post by Evatec AG

#LAYERS 9 - Innovations and Opportunities in Panel Level Packaging Things are moving fast in the world of Panel Level Packaging. Evatec has been shaping this market from the very beginning and continues to adapt its technologies and product portfolio to the latest developments and future trends. Building on proven panel level PVD solutions, Evatec’s roadmap focuses on redistribution layer and backside metallization, through glass via technologies, and reactive ion etching for PCB and IC substrate manufacturing. With projects starting at the 310 × 310 mm format and extending toward larger panel sizes, CLUSTERLINE® platforms are being prepared to support advanced packaging requirements for AI chiplets and high bandwidth memory applications. Read the full article here: https://lnkd.in/eFKQGPwQ 📩 Order your copy of the full LAYERS 9 magazine as a PDF or hard copy by writing to [email protected] #TheThinFilmPowerhouse #AdvancedPackaging #PanelLevelPackaging