Post by EV Group

In a continued collaboration with imec we could demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and a record high post-bonding overlay accuracy. Together, we put our focus on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking. To read our full anouncement, released just in time for ECTC, please head over to https://lnkd.in/du6Uy_De Picture source: IMEC