Post by EV Group

As we're getting closer to #ECTC next week, we want to highlight our participation at this year's event with the following professional development course and talks: - “Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging” (Professional Development Course, Tue., May 26, 8:00am-12:00pm) – Tobias Wernicke, Process Technology Manager – Wafer Bonding at EV Group, addresses fundamental and practical aspects of low-temperature fusion and hybrid bonding to provide a comprehensive understanding of the status and manufacturing potential of this technology for current and future applications - “First Demonstration of 450nm Pitch Cu-Cu Hybrid Bonding with 98% Yield Across 20M Interconnects for Ultra-Dense 3D Integration” (Session 18: Hybrid Bonding: Advanced Processing and Modeling, Thu., May 28, 11:15-11:35am) – co-authored with Applied Materials - “Fabrication and Transfer of Fine Pitch RDL Using Si Temporary Carrier Combined With IR Laser Release Approach” (Session 21: Novel Laser-Based Technologies and Fine-Pitch Interconnects, Thu., May 28, 2:00-2:20pm) – co-authored with imec - “Process Integration for 300nm-Pitch Hybrid Bonding with SiCN: 50nm Overlay, Fine-Grain Cu Metallurgy, and Reliability Assessment” (Session 26: Advanced Wafer-to-Wafer Hybrid Bonding, Fri., May 29, 11:35-11:55am) – co-authored with Applied Materials - “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” (Session 27: Innovation in Glass and Dielectric Materials for Heterogeneous Integration, Fri., May 29, 11:35-11:55am) – co-authored with Asahi Kasei Corporation - “Layer Transfer of Epitaxial Ru by Metal-Metal Bonding: Towards Single-Crystal Interconnects” (Session 33: Emerging Materials and Interconnect Technologies for Advanced Packaging, Fri., May 29, 2:40-3:00pm) – co-authored with imec - “Advanced Metrology for Heterogeneous Chiplet Integration with High-Speed 100% Bond Overlay Measurement” (Session 39: Interactive Presentations Bonding Processes and Analysis in Next Generation Interconnects, Thu., May 28, 10:00am-12:00pm) – co-authored with Intel - “Innovative Materials for Advanced Packaging – Materials for Packaging, Integration and Performance” (Special Session, Tue., May 26, 3:30-5:00pm) – Dr. Ksenija Varga, business development manager for EVG, co-chairs this panel discussion featuring a lineup of industry experts that will review new materials for different areas of advanced packaging from substrates to redistribution layers, interposers, chiplets and the integration thereof. We're also looking forward to your visit to EVG’s booth 220 during exhibition hours. Read our full press release here: https://lnkd.in/dWvEwXcX