Post by DYCONEX

Meet DYCONEX at today’s Evertiq Expo in Berlin! Join Daniel Schulze, Director of Application Engineering, for his presentation about Miniaturization and fineline PCB production: Where: Conference Area “Evertiq - Global” When: 14:40–15:10 h Venue: TEC Event Campus, Berlin Daniel will share insights into advanced PCB manufacturing for increasingly miniaturized electronic applications — from fine-line structures and semi-additive processes to the practical challenges of high-mix, low-volume production. A key topic: how advanced subtractive processes enable lines and spaces down to 18 µm, while additive plating technologies open the path to even finer structures below 10 µm. Come by, meet the DYCONEX team with Daniel and Manfred Bucher and discuss how advanced PCB technologies can support your next high-reliability application. #DYCONEX #EvertiqExpo #Berlin #PCB #Miniaturization #FineLinePCB #SAP #ElectronicsManufacturing #AdvancedPCB