Post by Corintis

We are thrilled to be at the IEEE ITherm Conference 2026! This year was a milestone for the Therminator ecosystem. Our thermal emulator — built to accelerate thermal testing and validation for next-gen chips and peripheral systems — is now compatible with a growing set of programmable silicon TTVs, all open for order: 🔹 Blizzard TTV — a high-power, multi-die platform designed to replicate the thermal behavior of the most advanced XPU + HBM architectures on the market today, delivering realistic high-density heat emulation for next-generation cooling validation. 🔹 Robin Hood TTV — engineered to mirror the complexity of leading multi-die GPU architectures, featuring a dense arrangement of XPU, HBM, and IO dies for rigorous, system-level thermal emulation at scale. 🔹 Chinook TTV — a full-reticle single-die platform built on open industry standards, ideal for TIM characterization, power cycling tests, and thermal model calibration across a wide range of cooling scenarios. Whether you're designing next-gen AI accelerators or optimizing data center efficiency, Corintis microfluidic cooling delivers the precision, scalability, and sustainability your systems demand. If we didn't get to connect at the show, we'd love to continue the conversation — reach out at [email protected]